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Temperature Forcing Systems

Sanwood Technology's Temperature Forcing Systems deliver high-velocity, localized thermal airstreams directly to the device under test (DUT), eliminating the thermal mass latency inherent in conventional bulk climatic chambers. Engineered for advanced semiconductor characterization, wafer-level reliability verification, and seamless ATE interface integration, this platform transitions from extreme cryogenic baselines to high-temperature thresholds in seconds.

This localized thermal injection is critical for tracking real-time parametric drift, verifying wide-bandgap semiconductor (SiC/GaN) stability, and exposing latent IC package thermal faults in absolute alignment with JEDEC and AEC-Q100 protocols.

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Temperature Forcing Systems

Temperature Forcing System

Thermal Air Stream System for Semiconductor Testing

The SANWOOD Temperature Forcing System delivers temperature-controlled air from −80°C to +225°C to a selected component or test area. It provides localized thermal conditioning for semiconductor characterization, electronic component evaluation and temperature-dependent failure analysis.

Keep the sample connected to electrical or optical instruments while examining its response to hot and cold conditions. Engineers can investigate operating margins, compare performance at defined temperatures and isolate faults that may remain hidden during room-temperature testing.

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Thermal Cycling Test System

Achieving thermodynamic performance that approaches localized temperature forcing systems requires a single-enclosure configuration capable of executing extreme, high-velocity linear ramp profiles to capture transient thermo-mechanical fatigue propagation.

Sanwood thermal cycling test systems redefine high-rate environmental stress screening by delivering near-forcing thermal dynamics across an entire testing enclosure. Positioned as the ultra-performance tier within our environmental test chamber ecosystem, this platform replaces passive thermal soaking with radical, linear ramp transitions. By forcing severe volumetric expansion and therm...

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