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Temperature Forcing System

Thermal Air Stream System for Semiconductor Testing

The SANWOOD Temperature Forcing System delivers temperature-controlled air from −80°C to +225°C to a selected component or test area. It provides localized thermal conditioning for semiconductor characterization, electronic component evaluation and temperature-dependent failure analysis.

Keep the sample connected to electrical or optical instruments while examining its response to hot and cold conditions. Engineers can investigate operating margins, compare performance at defined temperatures and isolate faults that may remain hidden during room-temperature testing.

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Component-Level Thermal Test System

Bring temperature conditioning to the measurement point—from early device characterization to investigation of field-return failures.

Temperature Forcing System

Key Temperature Forcing System Features

Select the temperature reference and airflow arrangement around the requirements of your test.

  • •Rapid air temperature transitions: Typical transitions from −55°C to +125°C, and from +125°C to −55°C, take approximately 10 seconds.
  • •Air Mode and DUT Mode: Control air temperature or use feedback from the device under test, depending on the measurement objective.
  • •External thermocouple inputs: Type-T and Type-K inputs support temperature feedback from a defined location on the sample.
  • •Localized airflow delivery: A specified output of 4–18 scfm provides hot and cold air at the selected test area. Sample coverage and heat transfer should be evaluated with the intended fixture.

Air transition time describes the temperature change of the delivered air; it does not establish the sample’s stabilization time.

Temperature Forcing System

Semiconductor and Electronic Component Testing Applications

Combine thermal conditioning with the appropriate measurement instruments to evaluate temperature-sensitive behavior.

  • •Digital and analog IC characterization: Measure changes in leakage current, timing, voltage thresholds and reference accuracy at selected temperatures.
  • •RF and mixed-signal evaluation: Investigate gain variation, frequency response, oscillator drift and signal stability.
  • •Optical transceiver testing: Evaluate optical output, receiver sensitivity and bit error rate using external optical and communication test equipment.
  • •Power semiconductor testing: Examine switching and conduction behavior while accounting for device power dissipation and fixture heat transfer.

  • •Sensor and MEMS testing: Assess offset, sensitivity and output drift across the intended operating temperature conditions.
  • •Failure analysis: Apply temperature changes to a suspect component or board area to help reproduce intermittent symptoms and narrow the investigation.


Temperature Forcing System

Test Standards and Method Selection

For projects with specified qualification requirements, review the applicable test method before selecting the equipment and fixture. 

  • •JEDEC JESD22-A104: Temperature cycling for semiconductor package and interconnect reliability evaluation.
  • •MIL-STD-883-1, Method 1010: Temperature cycling of microcircuits.
  • •IEC 60068-2-1:2025: Cold testing.
  • •IEC 60068-2-2:2025: Dry heat testing.

  • •IEC 60068-2-14:2023: Change-of-temperature testing.

These references guide equipment selection; they do not constitute a declaration that the SMS-810-10S meets every listed method. Confirm suitability for the required test condition, specimen and configuration.

Temperature Forcing System

Integration with Laboratory Test Equipment

Plan the thermal-head position around the fixture, measurement connections and available workspace. 

  • •Thermal-head positioning: Motorized vertical lift and pneumatic actuation support placement at the test location, with local operation and remote interface control.
  • •Host-PC monitoring: LAN and CAN interfaces support remote monitoring. Confirm the supported protocol and software requirements when connecting to an existing test platform.
  • •Access for measurements: Arrange probes, power leads and optical fibers so that connections remain usable without obstructing airflow to the sample.
  • •Cooling without liquid cryogens: Operation does not require an external supply of liquid nitrogen or liquid carbon dioxide.

Use the positioning envelope and installation dimensions below to review bench clearance, fixture access and service space before installation.

  • Basis Data

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